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SECO Presents MediaTek Edge AI Modules and HMIs

The new MediaTek-based embedded platforms enable local AI processing for industrial automation and medical device interfaces.

  www.secotools.com
SECO Presents MediaTek Edge AI Modules and HMIs

Embedded systems increasingly execute AI workloads directly on the device to avoid latency and connectivity dependence in industrial and medical equipment. In this context, SECO will introduce MediaTek-based system-on-modules and AI HMIs, expanding its edge AI portfolio at Embedded World 2026 (March 10–12, Nuremberg).

New SOM generation built around low-power AI processors
The SOM-Trizeps-X-Genio360/360P extends the Trizeps SODIMM System-on-Module family using the MediaTek Genio 360 and pin-compatible Genio 360P IoT processors. These 6 nm processors integrate CPU resources with a neural processing unit exceeding 8 TOPS, enabling on-device inference and generative AI workloads without external accelerators.

Typical target applications include advanced industrial HMIs, handheld terminals, smart appliances and distributed AI edge nodes within an industrial IoT environment.

The module maintains core characteristics of the Trizeps platform:
  • 67.6 mm × 36.7 mm form factor
  • SODIMM connector for integration into carrier boards
  • Long-term pin and software compatibility
  • Typical power consumption below 5 W
  • Industrial temperature range −40 °C to +85 °C
Support for 4K displays, camera interfaces and industrial connectivity allows integration into inspection terminals, control panels and mobile service devices requiring local visual processing.

Local AI processing in industrial interfaces
The Modular Vision platform provides industrial human–machine interfaces combining computing hardware and lifecycle software management through Clea OS.

A highlighted configuration, Modular Vision 15.6 Genio700, uses the MediaTek Genio 700 processor to run AI inference directly on the device. The system supports medical automation terminals, voice-controlled operation panels and visual inspection interfaces. A variant based on MediaTek Genio 510 offers an alternative balance between performance and power consumption for comparable applications.

Live demonstrations will show face recognition, speech processing and sample inspection operating locally with low latency, without cloud dependency, suitable for environments requiring deterministic response and data locality.

Unified software layer for deployment and maintenance
MediaTek-based platforms are supported by SECO’s software environment combining the Application Hub, Developer Centre and Clea framework. The stack provides model optimisation, secure deployment and lifecycle management while enabling central monitoring and updates.

This architecture allows locally executed AI inference while maintaining remote device oversight across distributed installations in a digital supply chain.

www.seco.com

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