Microchip Technology has expanded its hardware portfolio with an industrial-grade midspan to simplify power delivery for automated manufacturing environments.
OMRON Corporation is integrating advanced simulation and artificial intelligence libraries to automate thermal warpage analysis in semiconductor manufacturing environments.
Rosenberger presents a comprehensive development approach for autonomous telematics platforms for resource monitoring in logistics, industry, and construction.
Integration with Google DeepMind 's advanced generative AI enables the robot to assess on-site conditions, assemble work procedures, and execute them independently.
The i.Cee² industrial edge module from igus provides a platform for data acquisition and condition monitoring, designed to bypass the complexity of traditional digital infrastructure.
NEC Corporation has developed an AI-based system to generate detailed 3D models in one minute from standard smartphone footage by optimizing point density.
The wenglor sensoric group has developed new optical and ultrasonic sensing components to improve object detection within space-constrained manufacturing environments.