From October 5–7, in Chicago, USA, SINTRONES Technology demonstrates edge AI computers engineered to eliminate cloud-latency bottlenecks in vision processing and operational transit monitoring.
Kyocera Corporation announced the KJ4A-EX600RC-HX circulating inkjet printhead to support high-opacity white ink, spot varnish, and digital cold-foil embellishment across label converting lines.
Xiris Automation introduces a software platform that enables near-infrared cameras to perform simultaneous seam tracking and process monitoring in robotic welding environments.
Trend Micro integrates threat intelligence with NVIDIA digital infrastructure to enforce operational security across agent models, runtimes, and hardware interfaces.
Infineon is introducing a new series of Hall-effect sensors featuring automated on-chip calibration to support precise rotor position feedback in brushless DC motors.
The industrial-grade DDR5 8000 RDIMM delivers 8000 MT/s data transfer speeds, 16GB–64GB capacities, and registered ECC architecture to support demanding AI and enterprise-server workloads.
BOPLA introduces modular packaging systems featuring transparent film heating and advanced cooling mechanisms for industrial Internet of Things applications.
AMD collaborated with industry robotics partners to implement heterogeneous processing architectures and open software frameworks for edge-level autonomous systems.
Emerson develops a configuration management tool designed to automate data synchronization between physical plant control networks and simulated testing environments.