Balluff introduces a fanless high-speed industrial camera combining 25GigE, RDMA technology, and over 100 fps at 24.6 MP in a compact 40 × 40 mm housing.
Thanks to its combination of generous dimensions, high precision, advanced automation and digital connectivity, the Ecomill Plus HPC3 is an ideal choice for general engineering companies looking to increase their competitiveness and productivity.
SICK introduces a photoelectric sensor engineered to maintain stable detection in automated production environments with changing materials and ambient influences.
The ultra-compact CX9240 and CX82xx Embedded PC series from Beckhoff open up entirely new application areas with modern multi-core ARM Cortex A53 processors.
onsemi’s new EliteSiC MOSFETs in T2PAK top-cool packaging improve thermal efficiency, reliability and design flexibility for EVs, solar and energy-storage applications.
FabEagle MES v4.3 adds web analytics, REST machine connectivity, and role-based dashboards to boost KPI accuracy, traceability, and agile production control in automated PV lines.
Designed for autonomous robotics, manufacturing equipment, and medical devices, the new modules provide industrial-grade reliability and next-generation AI computing efficiency at the edge.
The system allows for the precise simulation and optimization of high-speed robot motion control and AI visual algorithms prior to physical deployment, ensuring both real-time responsiveness and exceptional precision.