Visitors to the world’s most powerful tech event will discover how the latest thermal camera advances from Flir take condition monitoring to new levels of capability and ease of use.
IDS strengthens its market position with double-digit growth targets, an expanded product roadmap in AI, 3D and monitoring cameras, and a new three-year manufacturer’s warranty.
Targeting solids control in wastewater pumping, the new macerator design focuses on faster servicing, reversible wear parts, and throughput up to 100 m³/h.
Hyundai Motor Group outlines a physical AI deployment strategy through its Robotics LAB, detailing how an on-device edge AI processor developed with DEEPX supports scalable, low-power autonomous robots.
Hexagon integrates conversational AI into EcoSys 9.4 to enable data-driven control of complex capital projects across energy, infrastructure and industrial programs.
Telit Cinterion and Nokia are collaborating to integrate multi-access wireless connectivity with in-network edge computing for mission-critical industrial operations.
The EXMP-Q911 COM-HPC Mini module combines Qualcomm Dragonwing SoCs, up to 100 TOPS AI performance, and long-term industrial reliability to support scalable ARM-based edge deployments.
How Synopsys applies virtualization and simulation to support software-defined vehicle development and system-level validation across the automotive data ecosystem.
NXP Semiconductors introduces an agentic AI software foundation for low-latency, secure decision-making on edge devices across industrial, automotive, and IoT applications.