Designed for next-generation Vision and Agentic AI, the AIR-075 delivers a massive 2,070 TFLOPS of AI compute and features four native 10GbE ports optimized for high-bandwidth, multi-camera deployments.
The Emerson booth will feature the company's latest Branson Polaris Ultrasonic welding platform, laser and heat staking technologies, automation solutions and Industry 4.0 connectivity gateways.
Melexis introduces a 5V analog resolver that allows flexible sensor placement in constrained vehicle and robotic mechanisms requiring high-speed rotor feedback.
Epson introduces a carbon-body collaborative arm manipulator engineered to resolve space constraints and hygiene requirements within sensitive automated manufacturing environments.
Oriental Motor introduces a dedicated drive calculation unit engineered to streamline drive integration and position feedback across industrial automated guided vehicles.
Vecow has integrated the NVIDIA JetPack 7.2 software framework into its rugged embedded computing portfolio to enhance industrial automation capabilities.
Belden introduced updated networking hardware, edge gateways, and cabling solutions to support integrated industrial control systems and enterprise IT architectures.