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CEVA WI-FI 6 IP POWERS ESWIN ECR6600 SMART CONNECTIVITY IC

Beijing ESWIN Technology Group Co. Ltd has leveraged the RivieraWaves Wi-Fi 6 1x1 IP platform in its ECR6600 smart connectivity IC targeting the consumer and IoT markets.

CEVA WI-FI 6 IP POWERS ESWIN ECR6600 SMART CONNECTIVITY IC

CEVA, Inc. recently announced that Beijing ESWIN Technology Group Co. Ltd ("ESWIN") a semiconductor products and services supplier, has licensed and deployed the RivieraWaves Wi-Fi 6 1x1 IP platform in its ECR6600 smart connectivity IC targeting smart homes, smart transportation, industrial IoT and more.

Global technology intelligence firm ABI Research forecasts that shipments of Wi-Fi 6 enabled chips will grow at a CAGR of 21% from 2022 to 2027 to surpass 3.8 billion units annually by 2027.

CEVA's RivieraWaves Wi-Fi 6 IP platforms provide comprehensive solutions for the integration of Wi-Fi connectivity into any IC or SoC design. It incorporates PHY modem functions and MAC functions, including Lower MAC (LMAC) and Full MAC software protocol stacks. The IP is provided with an integration-ready processor and operating system-agnostic platform, simplifying deployment. A flexible radio interface allows the platforms to be deployed with various partners' Wi-Fi RF IP, enabling optimal selection of foundry and process nodes. An optimized Wi-Fi & Bluetooth coexistence interface with a Packet Traffic Arbiter is also available for smooth simultaneous operation for combo chips.

With more than 3 billion CEVA-powered Bluetooth and Wi-Fi devices shipped to date and dozens of licensees, the RivieraWaves Bluetooth and Wi-Fi IPs are widely deployed in consumer, smart home, industrial and IoT devices with many of the world's leading semiconductors companies and OEMs.

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