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Leoni News

More stable and leaner: Leoni synchronises product and process development with its Innovation Industrialization Center (IIC)

As of now, researchers, engineers and production specialists at Leoni will be closely linked in creating the wiring system of the future – at the Innovation Industrialization Center (IIC) in the Franconian town of Kitzingen. With this think tank, the Company will be strengthening its position as an innovation partner to the automotive industry.

Mitsubishi Electric News

Mitsubishi Electric’s support for the automotive industry highlighted at the North East Automotive Expo

Mitsubishi Electric is showcasing how its automation technologies can drive the entire electric vehicle value chain forward at the North East Automotive Expo 2022, taking place on 29th September 2022. During the event, visitors will be able to learn more about robotised systems, cyber security solutions, smart energy and many other data-driven opportunities on stand B66.

Pilz News

Range of safe, configurable small controllers PNOZmulti 2 with new, high-performance standalone base unit - Compact and economical basic power!

In the range of safe configurable small controllers PNOZmulti 2 from Pilz, the new standalone base unit PNOZ m C0 is now available. The extremely compact base unit is just 22.5 mm wide and monitors up to four safety functions on machines.

ARROW News

Arrow Electronics demonstrates advanced machine vision development capabilities at VISION show

Arrow Electronics will be exhibiting at VISION, the world’s leading trade fair for machine vision, in Stuttgart (hall 8, booth C-33). The company will showcase a range of technologies, building blocks, and support services that help accelerate the development of embedded systems essential for machine vision applications.

Siemens digital Industry Software News

Siemens collaborates with UMC to develop 3D integrated circuit hybrid bonding workflow

Siemens Digital Industries Software today announced it has collaborated with leading semiconductor foundry United Microelectronics (UMC) to develop and implement a new multi-chip 3D integrated circuit (IC) planning, assembly validation and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies. UMC plans to soon offer this new flow to its global roster of customers.

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