18 {{ "2022-05-18T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-05-18T00:00:00+00:00" | date "longDate" }}

Sensata Technologies News

Sensata Technologies Adds Predictive Maintenance for Rotary Equipment to Sensata IQ Platform via Partnership with Nanoprecise

Sensata Technologies, today announced that it has launched a new asset monitoring solution that enables predictive maintenance for rotary assets and delivers actionable insights to plant managers.

Read more…

18 {{ "2022-05-18T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-05-18T00:00:00+00:00" | date "longDate" }}

Delta Logic News

Simatic WinCC OA also on a smaller scale: Executable Library for Raspberry Pi

Through the support of their long-standing partner, DELTA LOGIC Automatisierungstechnik GmbH, the SIMATIC WinCC OA platform-independent SCADA system can be now installed on Raspberry PI allowing unlimited data exchange with applications.

Read more…

18 {{ "2022-05-18T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-05-18T00:00:00+00:00" | date "longDate" }}

Specim News

SPECIM HIGHLIGHTS COMPLETE AND EASY-TO-DEPLOY SPECTRAL IMAGING PLATFORM AT AUTOMATE 2022

Specim, Spectral Imaging Ltd., demonstrates SpecimONE, a spectral imaging platform that makes it easy to create sorting applications without coding or in-depth knowledge of hyperspectral imaging.

Read more…

18 {{ "2022-05-18T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-05-18T00:00:00+00:00" | date "longDate" }}

TE Connectivity News

TE Connectivity and Phoenix Contact announce joint development agreement for Single Pair Ethernet hybrid cable assemblies

TE Connectivity (TE) will jointly develop with Phoenix Contact new Single Pair Ethernet (SPE) M12 hybrid connectivity.

Read more…

18 {{ "2022-05-18T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-05-18T00:00:00+00:00" | date "longDate" }}

Intepro Systems News

Upgrading ATE Test Stations with Intepro

Intepro’s upgrade solutions improve workflow and provide value.

Read more…

18 {{ "2022-05-18T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-05-18T00:00:00+00:00" | date "longDate" }}

Congatec News

congatec simplifies Arm deployments with i.MX 8M Plus

Arm Project Cassini completed: congatec modules with NXP i.MX 8M Plus processor now Arm SystemReady IR certified.

Read more…

18 {{ "2022-05-18T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-05-18T00:00:00+00:00" | date "longDate" }}

Diodes Incorporated News

32-Lane PCIe 3.0 Packet Switch from Diodes Incorporated Addresses Fan-Out and Multi-Host Connectivity

Diodes Incorporated today announced the introduction of a PCIe^® 3.0 packet switch IC. DIODES PI7C9X3G1632GP provides flexible multi-port and lane width configuration, resulting in elevated levels of performance and availability.

Read more…

17 {{ "2022-05-17T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-05-17T00:00:00+00:00" | date "longDate" }}

Avnet News

AVNET SILICA TO SHOWCASE INNOVATIVE AI / ML TECHNOLOGIES AT EMBEDDED WORLD

Avnet Silica, an Avnet company, will exhibit at embedded world, the leading trade fair for the embedded community, from 21 – 23 June 2022 in Nuremberg, Germany.

Read more…

17 {{ "2022-05-17T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-05-17T00:00:00+00:00" | date "longDate" }}

Mitsubishi Electric Europe - EMEA

Machine Controllers in the era of IIoT are multi-tasking like never before…

The requirement to multi-task while maintaining precise control over a machine (or multiple machines) means a modular PLC construction is more important than ever. The latest IoT Gateway available for Mitsubishi Electric’s advanced iQ-R Series PLC is a perfect example. It makes use of the OPC UA standard designed to provide a direct exchange from smart OT devices to cloud based systems.

Read more…

17 {{ "2022-05-17T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-05-17T00:00:00+00:00" | date "longDate" }}

Weg News

Energy savings for packaging leader

Global motor manufacturer, WEG has successfully completed an energy saving project for Orleplast, a leading packaging manufacturer based in Brazil. With the initial goal of achieving greater productivity, Orleplast took the opportunity to invest in more efficient equipment for its site, turning to the experts at WEG’s Energy Efficiency Business Centre for support.

Read more…

Technical Articles

Photometric stereo inspection for moving objects

Case studies

Automating Carton Magazine Loading for Packaging Lines

Sensata Technologies Adds Predictive Maintenance for Rotary Equipment to Sensata IQ Platform via Partnership with Nanoprecise

Sensata Technologies, today announced that it has launched a new asset monitoring solution that enables predictive maintenance for rotary assets and delivers actionable insights to plant managers.

Simatic WinCC OA also on a smaller scale: Executable Library for Raspberry Pi

Through the support of their long-standing partner, DELTA LOGIC Automatisierungstechnik GmbH, the SIMATIC WinCC OA platform-independent SCADA system can be now installed on Raspberry PI allowing unlimited data exchange with applications.

SPECIM HIGHLIGHTS COMPLETE AND EASY-TO-DEPLOY SPECTRAL IMAGING PLATFORM AT AUTOMATE 2022

Specim, Spectral Imaging Ltd., demonstrates SpecimONE, a spectral imaging platform that makes it easy to create sorting applications without coding or in-depth knowledge of hyperspectral imaging.

TE Connectivity and Phoenix Contact announce joint development agreement for Single Pair Ethernet hybrid cable assemblies

TE Connectivity (TE) will jointly develop with Phoenix Contact new Single Pair Ethernet (SPE) M12 hybrid connectivity.

Upgrading ATE Test Stations with Intepro

Intepro’s upgrade solutions improve workflow and provide value.

congatec simplifies Arm deployments with i.MX 8M Plus

Arm Project Cassini completed: congatec modules with NXP i.MX 8M Plus processor now Arm SystemReady IR certified.

32-Lane PCIe 3.0 Packet Switch from Diodes Incorporated Addresses Fan-Out and Multi-Host Connectivity

Diodes Incorporated today announced the introduction of a PCIe^® 3.0 packet switch IC. DIODES PI7C9X3G1632GP provides flexible multi-port and lane width configuration, resulting in elevated levels of performance and availability.

AVNET SILICA TO SHOWCASE INNOVATIVE AI / ML TECHNOLOGIES AT EMBEDDED WORLD

Avnet Silica, an Avnet company, will exhibit at embedded world, the leading trade fair for the embedded community, from 21 – 23 June 2022 in Nuremberg, Germany.

Machine Controllers in the era of IIoT are multi-tasking like never before…

Energy savings for packaging leader

Technical Articles

Case studies

Sensata Technologies, today announced that it has launched a new asset monitoring solution that enables predictive maintenance for rotary assets and delivers actionable insights to plant managers.

Through the support of their long-standing partner, DELTA LOGIC Automatisierungstechnik GmbH, the SIMATIC WinCC OA platform-independent SCADA system can be now installed on Raspberry PI allowing unlimited data exchange with applications.

Specim, Spectral Imaging Ltd., demonstrates SpecimONE, a spectral imaging platform that makes it easy to create sorting applications without coding or in-depth knowledge of hyperspectral imaging.

TE Connectivity (TE) will jointly develop with Phoenix Contact new Single Pair Ethernet (SPE) M12 hybrid connectivity.

Intepro’s upgrade solutions improve workflow and provide value.

Arm Project Cassini completed: congatec modules with NXP i.MX 8M Plus processor now Arm SystemReady IR certified.

Diodes Incorporated today announced the introduction of a PCIe® 3.0 packet switch IC. DIODES PI7C9X3G1632GP provides flexible multi-port and lane width configuration, resulting in elevated levels of performance and availability.

Avnet Silica, an Avnet company, will exhibit at embedded world, the leading trade fair for the embedded community, from 21 – 23 June 2022 in Nuremberg, Germany.

Diodes Incorporated today announced the introduction of a PCIe^® 3.0 packet switch IC. DIODES PI7C9X3G1632GP provides flexible multi-port and lane width configuration, resulting in elevated levels of performance and availability.