Many industries are currently facing major challenges resulting from the significant changes in the wake of digitalisation, automation and the sustainability movement. In addition, customers expect an ever-increasing degree of flexibility and individualisation. The change opens up great opportunities for manufacturers. However, it takes expertise to make the most of it with the right resources.
Report made public by Metropolitan State University of Denver delivers qualification data for Antero® 840CN03 for additively manufactured end-use parts requiring high thermal and chemical resistance, and ESD properties.
Today, 3D Systems (NYSE:DDD), the leading additive manufacturing solutions provider, and the Saudi Arabian Industrial Investments Company (Dussur) have signed an agreement intended to expand the use of additive manufacturing (AM) within the Kingdom of Saudi Arabia and surrounding geographies, including the Middle East and North Africa.
Working with the local electricity authority and Italthai Engineering, Moxa facilitates substation automation in Pattaya, an important pilot site on Thailand’s ambitious Energy 4.0 journey while driving Thailand’s economic success.
Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, is pleased to announce its continued sponsorship of FIRST® Robotics Competition, which inspires innovation and fosters well-rounded life capabilities in tens of thousands of young people every year.
Artificial intelligence is regularly applied in areas such as image analysis and speech recognition. However, in the industrial production sector its potential is still scarcely used. Several Fraunhofer institutes have recently developed a solution as part of the lighthouse project “ML4P — Machine Learning for Production”, which aims to make industrial manufacturing much more efficient through the use of machine learning. The software suite is very flexible and can be easily applied in existing production processes.
RFID solutions for GEMÜ diaphragms. The new TIP 2.0 is an optimized design for enabling communication with diaphragms as part of Industry 4.0 interconnectivity. Using RFID chips in conjunction with CONEXO, diaphragms can be positively identified and relevant data can be read out.
The partnership between IAR Systems and Alif Semiconductor accelerates innovation in the embedded space through strong artificial intelligence (AI) and machine learning (ML) capabilities.
Toshiba Electronics Europe GmbH (“Toshiba”) announces a new series of Mikroelektronika Click boards featuring Toshiba bipolar stepper motor drivers to allow for quick and easy device evaluation and prototyping. The highly integrated motor drivers offer an extensive range of features and efficient operation, while saving PCB space and reducing bill of material (BoM) costs.