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Congatec News

CONGATEC SIMPLIFIES COM-HPC DESIGNS

Congatec – a leading vendor of embedded and edge computing technology – welcomes the publication of the COM-HPC Carrier Board Design Guide by the PCI Industrial Computer Manufacturers Group (PICMG) with the launch of a fully specification compliant ecosystem for engineers of COM-HPC Client and Server module based designs.

BCN3D News

ITERATIVE DESIGN WITH 3D PRINTING GIVES TWONAV’S GPS DEVICES STEADFAST RELIABILITY

Outdoor equipment manufacturer TwoNav is experiencing a more flexible, iterative design process, a quicker time to market, and a reduction in expenses since incorporating 3D printing. The company is not only using BCN3D’s technology for designing, prototyping, and end-use parts, but also for tooling in and around their production line.

CCLINK News

The digital transformation from CC-Link is here to help – don’t leave it waiting

The digitalisation of industrial processes is fundamental for businesses to thrive in a market that is ever more demanding and where competition is fierce. With a plethora of innovative technologies available, driving this transformation with a sustainable strategy is key.

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