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Case studies

Rockwell Automation Helps The Shyft Group Accelerate Innovation and Adoption of Commercial EVs

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05  '20
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Comau News

Comau introduces digital solutions at the Global Smart Factory Summit in Shanghai

On September 25, Comau attended the Global Smart Factory Summit in Shanghai. The summit is one of the most important events in smart manufacturing and digitalization with more than 300 OEM digital initiative experts in attendance, and over 20 eminent speakers delivering key-note speeches. Wang Junwu, Comau China's Engineering Director, introduced Comau's digitalization platform in.Grid.

05  '20
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Siemens News

Siemens and Macquarie’s Green Investment Group Launch Distributed Energy Venture Calibrant Energy

Macquarie’s Green Investment Group (GIG), Siemens Smart Infrastructure and Siemens Financial Services (SFS) today announced the formation of Calibrant Energy (Calibrant), a joint venture that offers comprehensive onsite Energy-as-a-Service (EaaS) solutions at no up-front cost for its customers, which include corporate and industrial clients, as well as municipalities, universities, schools and hospitals.

04  '20
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Mouser News

Now at Mouser: TE Connectivity's HTU31 High-Accuracy Humidity & Temperature Sensors for Harsh Environments

Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, is now offering the new HTU31 relative humidity sensors from TE Connectivity (TE), a world leader in connectivity and sensors. One of the smallest and most accurate humidity sensors on the market, the compact, high-accuracy sensors deliver reliable performance in harsh environments, including in industrial, automotive, and medical applications.

03  '20
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Bihl + Wiedemann News

ASI-5 DIGITAL MODULE WITH 16 I/OS: MAXIMUM FLEXIBILITY & CHANNEL-SPECIFIC DIAGNOSTICS

Gain maximum flexibility in your application with the new self-configuring 16 I/O digital module by Bihl+Wiedemann (BWU4230). The 16 digital signals of the ASi-5 slave can be distributed as required – e.g. to 12 proximity sensors and 4 valves in an application with packaging technology. The IP67 module is ideally suited for high I/O densities.

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