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FESTO News

AI Champions Baden-Württemberg: Festo wins

Festo's AI solution "Intelligent pneumatic runtime monitoring" was honoured at the "AI Champions Baden-Württemberg" awards ceremony of the Baden-Württemberg Ministry of Economics, Labour and Housing on 11 August.

TE Connectivity News

TE Connectivity’s AMPMODU 2 mm wire-to-board crimp receptacles and shrouded headers free up space on printed circuit boards

TE Connectivity (TE), a world leader in connectivity and sensors, is freeing up valuable space on printed circuit boards (PCBs) for design engineers with its new compact AMPMODU wire-to-board receptacles with crimp contacts and shrouded headers. With centerline distances of 2 mm, they occupy 38 percent less space on a PCB than connectors with a 2.54 mm [0.100”] centerline.

SCHUNK News

Sensitive toolholder

SCHUNK is entering a new era of toolholding: In September, delivery of the sensory hydraulic expansion toolholder iTENDO, the most sensitive toolholder on the market, will begin.

Leuze

Leuze is focused on “yellow”

In the field of automation technology, the colour yellow stands for safety at work. The safety expert Leuze, as a developer and provider of safety sensors, safety solutions and safety services for the entire life cycle of a machine, is now further increasing focus of the company’s safety competence in its business activities with a dedicated division. Leuze emphasizes this with the motto, “Safety at Leuze”.

Emerson News

Emerson Invests in inmation Software

Investment will enhance Emerson’s Plantweb digital ecosystem with advanced data management capability to help span the IT/OT needs of customers.

TDK News

TDK announces ultra-high AOP Analog MEMS microphone, ICS-40638

TDK Corporation introduces the InvenSense ICS-40638 MEMS analog microphone. The ICS-40638 microphone offers an ultra-high Acoustic Overload Point (AOP) of 138 dB Sound Pressure Level (SPL), exceptionally efficient 170 µA low power operation and high Signal to Noise Ratio (SNR) of 63 dB in a small 3.5 mm x 2.65 mm x 0.98 mm bottom port surface‐mount package.

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