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ams OSRAM News

AMS OSRAM BRINGS ARTIFICIAL INTELLIGENCE (AI) TO SMART PRODUCTS

Image sensors from ams OSRAM in conjunction with AI processors make consumer and industrial products operate better, more efficient and safer – thanks to AI enhanced imaging.

BOBST News

From current trends and modular and future-proof solutions, to future steps

As the demands of converters and brand owners drive the current trends in the label industry, Patrick Graber, Strategic Product Marketing Manager in BOBST Narrow and mid-web Printing & Converting, deep dives into the different reasons why the DIGITAL MASTER series meets the needs of this fast-changing market.

Andritz News

ANDRITZ to supply new push pickling line for AHSS grades to Ternium, Mexico

International technology group ANDRITZ has received an order from Ternium in Pesquería near Monterrey, Nuevo León, Mexico, to supply a new high-end push pickling line (PPL), designed for advanced high-strength steel grades.

SSB Wägetechnik News

SSB turns 31 and has a new film

Almost exactly 31 years ago on 22.11.1991 our SSB Wägetechnik GmbH was founded, at that time still under the name SSB Steuerungsbau GbR (Lebrato and Partner).

Rohm Semiconductors News

ROHM Develops Ultra-Low-Power On-Device Learning Edge AI Chip

ROHM has developed an on-device learning AI chip (SoC with on-device learning AI accelerator) for edge computer endpoints in the IoT field. It utilizes artificial intelligence to predict failures (predictive failure detection) in electronic devices equipped with motors and sensors in real-time with ultra-low power consumption.

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